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Category:All HeadlinesWorld & GeopoliticsMarkets & EconomyTech & AIPoliticsSearch results for: "Intel and TSMC Push Panel" (30 stories)

Top Headline Story

Intel and TSMC Push Panel-Level Packaging as Market Sets to Expand Tenfold
Lead StoryTHE ELEC, Korea Electronics Industry Mediamarkets
Jul 2

Intel and TSMC Push Panel-Level Packaging as Market Sets to Expand Tenfold

<a href="https://news.google.com/rss/articles/CBMiZ0FVX3lxTFBwMi1Ra3MxREY3bDFnS29kN1FfenFvRExob1BtdnRZS3JLeTE0cnB5RnhIRFRYSkJZbE5jbmx2Ry1UU0QtVEJnbzNqMHNlSjd5eG1iWnBNNlpzU3g5VkF1QUNacnU5Wlk?oc=5" target="_blank">Intel and TSMC Push Panel-Level Packaging as Market Sets to Expand Tenfold</a>  <font color="#6f6f6f">THE ELEC, Korea Electronics Industry Media</font>

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Search Results for "Intel and TSMC Push Panel"

Updated every 3 minutes via FreeNewsApi, GNews, Currents API & Google News

29 stories displayed
TSMC targets 2029 for panel-level CoPoS packaging in AI chip push - DigiTimes
Yahoo Financetech

TSMC targets 2029 for panel-level CoPoS packaging in AI chip push - DigiTimes

<a href="https://news.google.com/rss/articles/CBMimAFBVV95cUxQNDM1YmFKTDFaaFBXVVhZLUN2S1Z5MDNFaXgxYnhaYXBqNFpsWmVUZ1BteUJtemVtdDh3eGhmM0UySzVNdERmc2dSbFBoSDd3cXcwcU9WeUVDUjVsVXc0dkF0MWloZlk4VmxRaFdSTWxKZ1NGcUVEQ3dBOWJTVEsxaUdBVnQ2Q3ZzaEtXRGEzay1YLWdMVDZXWA?oc=5" target="_blank">TSMC targets 2029 for panel-level CoPoS packaging in AI chip push - DigiTimes</a>  <font color="#6f6f6f">Yahoo Finance</font>

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[News] SCHMID Flags TSMC Panel-Level Packaging Push: 310×310mm Progress, Glass Integration Under Review
TrendForceworld

[News] SCHMID Flags TSMC Panel-Level Packaging Push: 310×310mm Progress, Glass Integration Under Review

<a href="https://news.google.com/rss/articles/CBMi8AFBVV95cUxNYndBeGpBU0pKaExrSlA1MlZDaVY4ZFczNVZUR3ZyTjZmMHNhMUVYQ3RXS19nb0NWalh0bmlRSi16aFVGYnYwSi02Q2lGSWpFX2FpRjZ1ZnN0dUtBYk01NlZPaXd6cFhsODBTcmhYeUN6dVY3TnhZRWFpS1o3N0RVY0RCWVhkUGdMZ3lTTUl4MVp2X0dwR2QzSGJFVmJjYVphS0pmTE5DS2JfUDZIRGJZYWwwVmxEX0NPU3RjM2hvMlhUNFVCQTFFYmJVMlFBdjZ2Ukd2X19sLTl3d2FYSHBTQ0h3LURwZzRFRXhJdG9sTXM?oc=5" target="_blank">[News] SCHMID Flags TSMC Panel-Level Packaging Push: 310×310mm Progress, Glass Integration Under Review</a>  <font color="#6f6f6f">TrendForce</font>

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Taiwan's AUO reportedly courted by both Intel and TSMC; advanced packaging buzz sends shares surging over 9% on heavy volume
BigGo Financetech

Taiwan's AUO reportedly courted by both Intel and TSMC; advanced packaging buzz sends shares surging over 9% on heavy volume

<a href="https://news.google.com/rss/articles/CBMidkFVX3lxTFBoSTdTSG5HaGh5c1hEcHJRdXNyckVvSDdJTXFCXzMzb0Q4QVN0MTNuclFvT0Vjb0NCTXlHQXRITWxyRGthVzFiTzdZckNnZUktcmpiZUsxRUh3bkQ5T01rLTZHV3BCNlBZeDc5R0FQd3ZvQWR1T3c?oc=5" target="_blank">Taiwan's AUO reportedly courted by both Intel and TSMC; advanced packaging buzz sends shares surging over 9% on heavy volume</a>  <font color="#6f6f6f">BigGo Finance</font>

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TSMC Chases Soaring AI Demand
EE Timestech

TSMC Chases Soaring AI Demand

<a href="https://news.google.com/rss/articles/CBMiZEFVX3lxTE9mdkU0a0dsRkVya3BTLTllbUhJbXpuUUlsWnVtRlBoeWtLb1JWWEpGTll5ZkNidWhaYmh3SjJoRExZZ2JVbnJpSi1aLVVpS1M4UGhidjlUM1V2MEh2NWpXQ3BVLVQ?oc=5" target="_blank">TSMC Chases Soaring AI Demand</a>  <font color="#6f6f6f">EE Times</font>

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Intel Cracks The Encapsulation Wall Blocking Hyper-Large Chips, Pushing Advanced Packaging To 24x Reticle Size and Beyond
Wccftechtech

Intel Cracks The Encapsulation Wall Blocking Hyper-Large Chips, Pushing Advanced Packaging To 24x Reticle Size and Beyond

<a href="https://news.google.com/rss/articles/CBMiqAFBVV95cUxPOGNiRHIxTWVvNzhMWFN6dVdUZ21Oc2dJekVaWFcxV25rYnpuMUVCWThDdXg3RmlUVkxyMUtEcExMNl9URDJwZUg3WnJSbHJHRjNPZGczV09IQkhPX1pCa19wQmtYVG1wU1pVbzZDSU4wWnBZandVUk9HRzFpcW9IaGdGRWRUQ01uX0R6c241QzY5QWZ5NU4wSE44c0ptd3lyamNDTjBjMDPSAa4BQVVfeXFMTWJLaTZkN0pjX2lkSHFsOUtrMmdJaXF4NUM0N1k2aHFBUXFfY2M5em1SWWJYeHlVbWZaZ0lOZjcxd05iTkNyVVB4YjJyVlRNOEE5ckhYY0FZS3dwRW1lSWJiQU52VFRhclZ0azdVbFY5NDNqc2RfSm5SM3NZZk0xSVJVcUxEWnNEaDhGSm8teW9xblBsRUR2YllOcVVVUDVHTVlRRC0xVXMwRFpvYTRn?oc=5" target="_blank">Intel Cracks The Encapsulation Wall Blocking Hyper-Large Chips, Pushing Advanced Packaging To 24x Reticle Size and Beyond</a>  <font color="#6f6f6f">Wccftech</font>

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TSMC's 310mm push threatens Samsung's PLP lead
digitimesworld

TSMC's 310mm push threatens Samsung's PLP lead

<a href="https://news.google.com/rss/articles/CBMikwFBVV95cUxPWEYxNVdFVmhkd2RHZ0loRWVpa0EzRDRqNzlVS3dVemlYWUh4WUNDZ3NGX0otQWJka0lHZE1lMlB3V2xHX2RQaXVWRDB5LTBkRVg0YlNzQkh1dkFfT1ZMdzFmbnJ6NTVYbkw5WW9EZldCbEZvZ1h0LUJ2cFVwbmE4cVpBZlZlV1dIcTZLM3A0dDJBRWM?oc=5" target="_blank">TSMC's 310mm push threatens Samsung's PLP lead</a>  <font color="#6f6f6f">digitimes</font>

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[News] Powertech Bets NT$70B on World’s First Panel-Level AI Chip Packaging in 2027, Potentially Ahead of TSMC
TrendForcetech

[News] Powertech Bets NT$70B on World’s First Panel-Level AI Chip Packaging in 2027, Potentially Ahead of TSMC

<a href="https://news.google.com/rss/articles/CBMi7AFBVV95cUxONE1jbnMzbjRRUzg3QldoemZlQ2VRM1h3LXpCa2xvWU41bHZRQjVYUTFpWUhqbVZrNjJ4c0o1YUpsQU5mUXBXWVVjN2tOU0cyQjhfWU1fdkMySkswWlBmWEhwXzRDZzFRQjRQWVRpM1VHZFg2NUtmS3lDMUt0bGxPaHYwdzhzbUhpUHJpNV9teTlmQ1pCa2NJY0QxUGFCbjZ0Y25XQ21IaDNGYk1Cc2h5dXgxc3p3ZVk5MVAxS2tMWm9iLXBMenpWVTM1OVpibzVhdWFBS1dtV1RkZXVDT014bmlqTFppNm10RWFpQQ?oc=5" target="_blank">[News] Powertech Bets NT$70B on World’s First Panel-Level AI Chip Packaging in 2027, Potentially Ahead of TSMC</a>  <font color="#6f6f6f">TrendForce</font>

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TSMC’s Packaging Moat Faces Its First Real Test as AI Chips Outgrow CoWoS｜Industry｜2026-04-20｜web only
天下雜誌tech

TSMC’s Packaging Moat Faces Its First Real Test as AI Chips Outgrow CoWoS｜Industry｜2026-04-20｜web only

<a href="https://news.google.com/rss/articles/CBMiZ0FVX3lxTFBkS2xBanhPemhuWjVtcTczUDBXSVhNZHBTRF9FZVozUE1ILUU1Z3VYMDJfckYtdTBzOWtMaERkc2paTm03Slp4dHFiWkgyakVzdjJJdW8zc01BU0poOTR2LUY3WlpfVW8?oc=5" target="_blank">TSMC’s Packaging Moat Faces Its First Real Test as AI Chips Outgrow CoWoS｜Industry｜2026-04-20｜web only</a>  <font color="#6f6f6f">天下雜誌</font>

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TSMC Completes Line for Next-Gen CoPoS Packaging, Sees Year to Maturity
Seoul Economic Dailygeneral

TSMC Completes Line for Next-Gen CoPoS Packaging, Sees Year to Maturity

<a href="https://news.google.com/rss/articles/CBMiqgFBVV95cUxPUUtiUG9JNnFXX0luTXpBQk9jOU40THY4enNwc2ZkXzI5OWlnLVpJVW1nNGxPcGtFQmZsVzZZU2VHZ2NxMGc4SjAyNm4tS3V2aDFmbFBrQl95SHV6ZG9EcHM0TU9vcFB4eklHSFhKZ1JHNXNyblBUZ2E0dWxTQVdfWXI1bTNBT0gwaUdOWEdoNnZpZXNRaG1uc2RFcEhxcWxDbEdDQWtiX3QwZw?oc=5" target="_blank">TSMC Completes Line for Next-Gen CoPoS Packaging, Sees Year to Maturity</a>  <font color="#6f6f6f">Seoul Economic Daily</font>

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TSMC reportedly pushes CoPoS exclusivity to lock in next-gen packaging lead
digitimesgeneral

TSMC reportedly pushes CoPoS exclusivity to lock in next-gen packaging lead

<a href="https://news.google.com/rss/articles/CBMilAFBVV95cUxOb2VQcV9GcDh3Vzg0aG1xQXVaMlFrczlSYUZ0Q0pnYTdXNUdaSndEemNGVnlDY1NhNThUdVhjcnRaclpsM2twN0lZZmYzLU0tcnAyN0g1SXJkcDlGZm1wUURVOEFDbW9ZVW9CWWZwRU53U2JJRzh5LUxsVDRZbUxnOE9LTnBJRHhrZ3I0UFZibVVILTVQ?oc=5" target="_blank">TSMC reportedly pushes CoPoS exclusivity to lock in next-gen packaging lead</a>  <font color="#6f6f6f">digitimes</font>

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TSMC Unveils CoPoS Glass Substrate Timeline: Chairman C.C. Wei Says No Shortcuts to Mass Production, At Least 2-3 Years Away
finance.biggo.comtech

TSMC Unveils CoPoS Glass Substrate Timeline: Chairman C.C. Wei Says No Shortcuts to Mass Production, At Least 2-3 Years Away

<a href="https://news.google.com/rss/articles/CBMiYEFVX3lxTE1CVkhvaUxsR3FYQWpUbzY1Ry1uNHZUSmtnVERMcmREUnZPbmRNbmVpNU1iYVBaR3pmN2l3a21rMEVMcXBuVnFuWGtNUFJvc1laemRzbzdPS2NFVV9lUy0wbA?oc=5" target="_blank">TSMC Unveils CoPoS Glass Substrate Timeline: Chairman C.C. Wei Says No Shortcuts to Mass Production, At Least 2-3 Years Away</a>  <font color="#6f6f6f">finance.biggo.com</font>

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[News] Samsung Reportedly Restarts 1.4nm Push, Targets 2029 Mass Production to Close Gap with TSMC, Intel
TrendForceworld

[News] Samsung Reportedly Restarts 1.4nm Push, Targets 2029 Mass Production to Close Gap with TSMC, Intel

<a href="https://news.google.com/rss/articles/CBMi3gFBVV95cUxNSGVpQ0JmemxqTUVTaEIzblRIbF9MM3BmN3ZVVnhPZEI3ZURrWG1iT0ptbmNzbjNjQU1oNTBvaUhhWnU3c2RCeHR3MFpvcDg0OGVCaE43YnpVdXlZNXVobjlfTm1FeU92S3JDSjFYM3B3S1NIRENkYng4d2MwMXdmb3dUTzctRWQ4RWotRXJhWWdjRjJQVjgyMGR0dGpIam5MNDZKVVBSdlNJYVcweEo4V2NYeEx0MDVNX1I1emxVV1ZkV09VaXhoUjBZOS1WTnZrM1hKN0FCd3UtSW9rbHc?oc=5" target="_blank">[News] Samsung Reportedly Restarts 1.4nm Push, Targets 2029 Mass Production to Close Gap with TSMC, Intel</a>  <font color="#6f6f6f">TrendForce</font>

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TSMC Is Reportedly Developing Advanced Chip Packaging Tech to Challenge Intel's Dominance
Yahoo Financetech

TSMC Is Reportedly Developing Advanced Chip Packaging Tech to Challenge Intel's Dominance

<a href="https://news.google.com/rss/articles/CBMiowFBVV95cUxPUF9iWWQ5aWtkeFN6MFBVVWtfYjBVU2VURDFkMGIybGRkNkM2cGt4cUtFY0FETVg0d20xWHdWNVl0VjJwMTdVcEZUTEktcHE1SkhRT0tJMHlndE1VY1BkY3kxUE13UXB2a3p6SEJXMjdwOWltUk1yNkVSYkNwMm5TemVQZ3BnQkNiMUlhRkcxMHh2RWdZaG9Tak9vM1FoZ1FtVE5Z?oc=5" target="_blank">TSMC Is Reportedly Developing Advanced Chip Packaging Tech to Challenge Intel's Dominance</a>  <font color="#6f6f6f">Yahoo Finance</font>

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TSMC Unveils First Glass Substrate Validation Data for CoWoS Packaging: Warpage Improved 16%, Pushing into New CoPoS Battlefield
finance.biggo.comworld

TSMC Unveils First Glass Substrate Validation Data for CoWoS Packaging: Warpage Improved 16%, Pushing into New CoPoS Battlefield

<a href="https://news.google.com/rss/articles/CBMiYEFVX3lxTFBJcWlsV1VWRW8yMG5wdDQzSmU3SUh1b19DcnJaS2ttWklHb1QwZnQ2WFgyYzF4MDdQWEpOaHRpNjE1SEJTSU9mNGtRUm5NWlZkSU10UHN1OFFUXzlkYldrOA?oc=5" target="_blank">TSMC Unveils First Glass Substrate Validation Data for CoWoS Packaging: Warpage Improved 16%, Pushing into New CoPoS Battlefield</a>  <font color="#6f6f6f">finance.biggo.com</font>

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ASE accelerates panel-level packaging push with fully automated 310mm line by 2026
digitimesgeneral

ASE accelerates panel-level packaging push with fully automated 310mm line by 2026

<a href="https://news.google.com/rss/articles/CBMiigFBVV95cUxQV3VfNmRicTI5ZTlBTU1KTFBneVRHT294dmRLcDh0d0FsZnJOOEpsTmlpNklFekFBQVUyc1hQTXFtR2RmSDB2MUpFWVJFSG9pRlVORkx4M205NHVfSlFMZG5uY181eEJNSnlCUTM3bDBuMlBkMFMyUUI2bkd1THRDdWtyUTdsQ0dPSHc?oc=5" target="_blank">ASE accelerates panel-level packaging push with fully automated 310mm line by 2026</a>  <font color="#6f6f6f">digitimes</font>

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[News] MediaTek Reportedly Adopts Dual Packaging Strategy With Intel EMIB, TSMC CoWoS for AI ASIC Push
TrendForcetech

[News] MediaTek Reportedly Adopts Dual Packaging Strategy With Intel EMIB, TSMC CoWoS for AI ASIC Push

<a href="https://news.google.com/rss/articles/CBMi2wFBVV95cUxNSExQZHhNaFF0LXN0bEpGUGtna01aVEZhNks0Z1cxZXhULTcwbnVERVNZdDEwOU42bHNmUGtDSGtMQ214VVNSVVhKeWlydllEOFBoLUhZNXVSMjFBXzVpU2hNeDZTTTdmdVA0R2Q5OUJ3dGpEcXZ4RkFXWEJOUDExX0JVNFk4empwRWhuZnlVX3hCd0hpQ3hUQXp2bDNyM0RVczNjSGZCS0Vtazhyc09MWE5BbnpWY2l6NkdQRHJ0eW9pY1o4SzVuZk5YaW5xNkpwak15dklGOXR2Wkk?oc=5" target="_blank">[News] MediaTek Reportedly Adopts Dual Packaging Strategy With Intel EMIB, TSMC CoWoS for AI ASIC Push</a>  <font color="#6f6f6f">TrendForce</font>

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Rapidus unveils glass interposer to challenge TSMC
digitimesworld

Rapidus unveils glass interposer to challenge TSMC

<a href="https://news.google.com/rss/articles/CBMilgFBVV95cUxOQ0JHckgxZEdkRVFkZnRZYXZaR2tIV2tEbElrTnpEUTZ2MnQ1MjFjOTRwbHVld29NMkUwbEJwODMyS0ZYX0R1d19ManMxSEhDZEk1WFUyV1lpQXFlbTZodkRpQktWSzRzRTZmQ255a05MQTFSMm1lRnNISm90ZTlHLUczR0pRZDlHSGxpenM1ZGxDTmJQaGc?oc=5" target="_blank">Rapidus unveils glass interposer to challenge TSMC</a>  <font color="#6f6f6f">digitimes</font>

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[News] Intel 18A Yields Up 7%–8% Monthly as 2H26 Customers Expected; Said to Push 18A CPUs Amid Shortages
TrendForcetech

[News] Intel 18A Yields Up 7%–8% Monthly as 2H26 Customers Expected; Said to Push 18A CPUs Amid Shortages

<a href="https://news.google.com/rss/articles/CBMi8AFBVV95cUxONkY2bzVubFdkNGt5cjBMSFhGWFQ1akZsZWxNd0stZm1YeWxuOVdrMGNzbU9WUVZUQmpBWW9QVzQ5ZGxMZ3VYamphT1dCX0dSS2xqN0hFOXJFTWRoVVVmS1BHRFJUZmQ5dUFHRG40Q1J0UkV5bzdnbUxEQktPMzRKMG4xSFQ0Wlg1cHFEZTJJYkxhVU82T193eE1mRkxseWNDcnFMc3JrSGp6bHROMThIclA5a0tBbHQzdURsVGx4NHBDdHc2LWkwM3ZkYW9fRUhsQjM2MlpQM3ZfNTJsVF9wWmFuNjBvNEpZQ0RvNEJFMXE?oc=5" target="_blank">[News] Intel 18A Yields Up 7%–8% Monthly as 2H26 Customers Expected; Said to Push 18A CPUs Amid Shortages</a>  <font color="#6f6f6f">TrendForce</font>

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[News] Intel Advances Glass Substrate Push with 3DGS, US$3.3 Billion India Plant Set for Five-to-Six-Year Buildout
TrendForcepolitics

[News] Intel Advances Glass Substrate Push with 3DGS, US$3.3 Billion India Plant Set for Five-to-Six-Year Buildout

<a href="https://news.google.com/rss/articles/CBMi6gFBVV95cUxPeHRkT05ULTFBdW16eDRfR2tpSjZhU1ZSaUM0Y1piUkhhOWlFdlE4ZTlpUHhLMnhLODhMS1NKbjFrV2s3UklYYU0tU1FKSTI1RFJvV3Q1aGVKeHBiQTJuSWtwcEhIZFdCSGNXX0pIbU85LVJTYm5jQm5XSnVCTjk5UlZHclBiQk1WRkhJZXFxSElabzBmcnQteXhvcGJxdXN6N0trX0FvNmQ0N1J3UlMtYXZHazNfX184MXRzNW1DNGxURHRNRkQ4WHNOLXBvQ2JHWkpPbU1BU0lyQnBrWHJjUTROS3gwc3g5Wnc?oc=5" target="_blank">[News] Intel Advances Glass Substrate Push with 3DGS, US$3.3 Billion India Plant Set for Five-to-Six-Year Buildout</a>  <font color="#6f6f6f">TrendForce</font>

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[News] Samsung Reportedly Pushes SoP Packaging on Ultra-Large Panel, Challenging TSMC and Intel
TrendForceworld

[News] Samsung Reportedly Pushes SoP Packaging on Ultra-Large Panel, Challenging TSMC and Intel

<a href="https://news.google.com/rss/articles/CBMi4AFBVV95cUxPVGNQSnZQMzNYNUR0TTU0WVFQV2JaZTByZk54VlNBNXJFR1ltb1VOTDA3ckVNVGVpdnlEUHVvZ08wVlFRbS1hSGRZd0NXOHB0Q3h0TXVuUUZqUkQ5ODBZdk5xZDRUN1BaMjl1M1Q0RlVrRE83eUlnZjIyRzBNdnJtVVVGUElpYjc3SmNra2Y2SWlDNHdfUWZJOGNkRjRtbWd0cmZIT0VjTEZSdjNCVXpHQXd2RTJLM0poS1V1MnBraHdwdm9lRkdkRS1RM3JLT0FQcW5kUC1BRjRxU1RMeXZHZA?oc=5" target="_blank">[News] Samsung Reportedly Pushes SoP Packaging on Ultra-Large Panel, Challenging TSMC and Intel</a>  <font color="#6f6f6f">TrendForce</font>

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EXCLUSIVE: TSMC pitched Intel foundry JV to Nvidia, AMD and Broadcom, sources say
Reutersworld

EXCLUSIVE: TSMC pitched Intel foundry JV to Nvidia, AMD and Broadcom, sources say

<a href="https://news.google.com/rss/articles/CBMirAFBVV95cUxOQ1A3NlEzWVRXVVlrOEVXT0dlNDJZRHlHQUZtTzZrOE5ZcXJ5Z3pYOWJQZUhhMHNQdWJLSU1hT2ktc2kzQU9PRC1od0pBY1pybXVya2RudTNYLUh6T0c3V0hLMHNvRWZnVEdFMXFLcEVQSllYaVdKV2tmakRyV1VzSzNQV1NTY2lOUUdtSUtwMS1KU21GM1FZTVBBOVdYSkUtMjdCb2dFRG1KU2g5?oc=5" target="_blank">EXCLUSIVE: TSMC pitched Intel foundry JV to Nvidia, AMD and Broadcom, sources say</a>  <font color="#6f6f6f">Reuters</font>

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[News] TSMC Earnings Preview: Terafab Talks, Price Hikes and A14-Intel Race Lead Five Key Themes
TrendForcegeneral

[News] TSMC Earnings Preview: Terafab Talks, Price Hikes and A14-Intel Race Lead Five Key Themes

<a href="https://news.google.com/rss/articles/CBMi0gFBVV95cUxQNVAyMTZfNTdsQko5WUxJTG96TlVmYzRpRERwZDRTRWxQTW9CLU9Va2pLb21vU1ZrOTZTSTUzcjlxXzZ0eTlTbkM0bjBZWkdBd1dWemRERVRxaGJ6WDkwTnhDbEl6YXVPQkk4Tmw4OXhWeERQSzFfeWp5VUpMckpxM0pXc1ZyQ01veHQ1bG9zdGVOeVpjM0JnZFhnMzdxMlA1UG05amR2YWI2NXBDUF91eDloZ3BpR0JqNFVTUEdJRzNNMkVlckpyM2ZsZm5NRGg2TFE?oc=5" target="_blank">[News] TSMC Earnings Preview: Terafab Talks, Price Hikes and A14-Intel Race Lead Five Key Themes</a>  <font color="#6f6f6f">TrendForce</font>

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[News] TSMC’s $265B U.S. Bet: “No Food Left on the Table” Despite 4-5x Higher Fab Construction Costs
TrendForcegeneral

[News] TSMC’s $265B U.S. Bet: “No Food Left on the Table” Despite 4-5x Higher Fab Construction Costs

<a href="https://news.google.com/rss/articles/CBMi0gFBVV95cUxOSXNmZFJoalRnOEtPS21mWWxueFZWOGxTNnNLR3ZWeDN3MWR3ZmNmczd0c1dVX3pIRm5UV2FHUlFMTWpILUUxR3VUTTVKa3VaMmFUMV9aU2dnSnVvVzJVY050QklnMUZSeVN2bEt3d1gzRk5UV3NOU2RjZWtyd2RjejBFSnNjVVBpckVDM3ZSVUJaQkJqSS1DMS0zY1V3NHlLbGNWeEtBa2pvNVNKM2RVcXBGeHJXSUJPckRuQjFobEJkaEZaZDlyREl2cDR1dENnREE?oc=5" target="_blank">[News] TSMC’s $265B U.S. Bet: “No Food Left on the Table” Despite 4-5x Higher Fab Construction Costs</a>  <font color="#6f6f6f">TrendForce</font>

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Tech giants TSMC and Sony to invest billions in advanced chip sensor plant
Yahoo Finance Australiatech

Tech giants TSMC and Sony to invest billions in advanced chip sensor plant

<a href="https://news.google.com/rss/articles/CBMigwFBVV95cUxPWF93QVdQcG83eWdUU3lacTgybHpMRnRhdXBsLWJJaHVPaEcyaS1NbjJ5RWlHRWhSbGVqbktibTdacmdlQ29vM0huMV9fa3l5QTdwYTA1QUU3aWluWkl0ZXpBR1lZY0ZhQWgxQXQtdG00NmVwdkFYYkV5TG42QTRneVJCcw?oc=5" target="_blank">Tech giants TSMC and Sony to invest billions in advanced chip sensor plant</a>  <font color="#6f6f6f">Yahoo Finance Australia</font>

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[News] SK hynix Reportedly Eyed as Potential Partner to Operate Intel’s Ohio Fab After Denying Acquisition Plans
TrendForcegeneral

[News] SK hynix Reportedly Eyed as Potential Partner to Operate Intel’s Ohio Fab After Denying Acquisition Plans

<a href="https://news.google.com/rss/articles/CBMi6AFBVV95cUxNZ3lTNjBOUW1CNW9NZ2NKOWtfeUtxaXh2dTBlZjdsT1ZMVHhmVnhfSUF5UnZpMnBISUhZalVZc1BIRTNCS1owRGZib1NiLXFHNUJMVkt5aTVVR2hKWkE5ZWxwNXl0NVdWS1ltQ2JCRUprcXVyck9uNkJvNHNWZ3dNYS02ekNXVmdyMnVaekxtR3EtZ21ma1ZHaF9KRUFhdmxvRGUtbUs0T3NsYUVDb2RKN21UV1o5WkpQOFF5NDlsX0l6ZGJVTXlMdEFKS184YWZQRmZRNjNHMWZFUWxTOFNSU0Q5RW1IZ3RZ?oc=5" target="_blank">[News] SK hynix Reportedly Eyed as Potential Partner to Operate Intel’s Ohio Fab After Denying Acquisition Plans</a>  <font color="#6f6f6f">TrendForce</font>

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[News] TSMC’s 1.4nm Fab Ahead of Schedule; First Building Expected Before Apr. 2027, Mass Production Seen by Mid-2028
TrendForcegeneral

[News] TSMC’s 1.4nm Fab Ahead of Schedule; First Building Expected Before Apr. 2027, Mass Production Seen by Mid-2028

<a href="https://news.google.com/rss/articles/CBMi6wFBVV95cUxQU2JIX0ZwZXZtX2tOWGRTRzB5MWoxRVRnOXF1WHZoZkQ2MjZBdmVLNjZ5bDZJa3hQbWsyd3g3VW93dU94Y2oyc0xObGlkdy1yUVk3QTdva3p2MmsycEZhV1p5R05LVlJwTGlHeVFnNVpSaWpoN1R5S3hYWDl6Z2F5Nzd2cUpab0ZfVk1DSndSZ2RwcDZESEhOYkRScDJ0ODlwa184OEtaTGtVTVdoTWcxQi1CVkRIcjJYYmhPblhWd2VRaDF0RUh0ZFFocHZLa3hlNEJteGJSX00wM21rRFFxdGlsN0RYMGRseDlF?oc=5" target="_blank">[News] TSMC’s 1.4nm Fab Ahead of Schedule; First Building Expected Before Apr. 2027, Mass Production Seen by Mid-2028</a>  <font color="#6f6f6f">TrendForce</font>

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Intel's 18A Yield Surges to 85%, Reportedly Securing Design Wins from AMD, Nvidia, OpenAI
BigGo Financetech

Intel's 18A Yield Surges to 85%, Reportedly Securing Design Wins from AMD, Nvidia, OpenAI

<a href="https://news.google.com/rss/articles/CBMidkFVX3lxTE1oSE5lR2RDUHpINy1oblBQQ3UyeG9jWHNUNldla2RvZlFxTUdFTzF2RWhiLU0xbktNRGdzMm1TX1hzY3dWZ1U5MmZLcnZJRF9BUzhTT2VPZEE3T2pOV05yWHpyM2RKUm9xcm9rdFhTYUs5UEFjMUE?oc=5" target="_blank">Intel's 18A Yield Surges to 85%, Reportedly Securing Design Wins from AMD, Nvidia, OpenAI</a>  <font color="#6f6f6f">BigGo Finance</font>

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TSMC announces revival of glass substrate R&D, challenging Intel's lead in advanced packaging tech
Notebookchecktech

TSMC announces revival of glass substrate R&D, challenging Intel's lead in advanced packaging tech

<a href="https://news.google.com/rss/articles/CBMi2AFBVV95cUxNOV9VeVlIRDAyU2dSMGpjbUU1azNoUEtNT1BZd1dHZUl0UVU3d1VZRi1qd0R1akZHU185V2lHakhGbXhiT3FMQmZ1QzVkaU1FZk9OU3hpd1R3bFphZDJhdWNTRWhESnFuZmVueU45Z01OSnhNbDI3Wlc5ZWNJdmMtY3B2Y0EtUnNQRHpLUE9lUmFYOWZaTW1sSUU0VlJiOWZ5cEpndzlKZmxfekloNHpDam43UDYwOGtMeWstbkdETmhhU1Q4ajNVZ2pNUUM1NS1NeWUxbDNubWI?oc=5" target="_blank">TSMC announces revival of glass substrate R&D, challenging Intel's lead in advanced packaging tech</a>  <font color="#6f6f6f">Notebookcheck</font>

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[News] JEDEC Unveils First Industry-Wide Silicon Photonics Reliability Standard, Setting Rules Across Four Key Areas
TrendForceworld

[News] JEDEC Unveils First Industry-Wide Silicon Photonics Reliability Standard, Setting Rules Across Four Key Areas

<a href="https://news.google.com/rss/articles/CBMi7gFBVV95cUxNOW1Zc2V4cjFEZ0cyNExYMnlRZlVvaWhzWGhvVFU5eFE3alUyM1NBSkg3YWlNRGk3YW9iSGhuVXpRZDRmQnQzN1AwQ0MzT3VyaG9ZWkRxX0x1WlVWZ2pGTE1aZmRyR3NrMWZJcDVlUXQySTc3N0hYU2poVzVISVlROXVFZ19SMjB4MVU3S000TmM3TDB2bzAxYVNnYmFKTlpJdFNaVHpJWnBvY3R2ZHZsMmQxbWJIejltM2RXbXpfb01OMTNtcUJ1QlFhOTE1alBvZTFlWnF5aDQyT3pQLWwwWmFYeTI0ZWhuRE5hejZB?oc=5" target="_blank">[News] JEDEC Unveils First Industry-Wide Silicon Photonics Reliability Standard, Setting Rules Across Four Key Areas</a>  <font color="#6f6f6f">TrendForce</font>

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"Intel and TSMC Push Panel" — Live Google News Trends & Headlines