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Category:All HeadlinesWorld & GeopoliticsMarkets & EconomyTech & AIPoliticsSearch results for: "Intel Counters TSMC With" (30 stories)

Top Headline Story

TSMC Develops AI Chip Packaging Tech to Counter Intel
Lead StoryThe Informationtech
Jul 30

TSMC Develops AI Chip Packaging Tech to Counter Intel

<a href="https://news.google.com/rss/articles/CBMilAFBVV95cUxNb2FZZ19yUVI5RGZacmJXYjlVOUNDOHJhY2J3YWh2aUdzeTFXV0xrMF9vdFNTVy1UQzVYaWJSN3VRak1fbHgyZndsMHpqMkRHRURHQnpMRkgxQWhoNkpoZkltVnY5eXFydEtCcmtSZTQ4TUR1RlRvZ1dkTmlYS2p5OFAzeS1qQkR5MXpFeE5kbTlMMHhC?oc=5" target="_blank">TSMC Develops AI Chip Packaging Tech to Counter Intel</a>  <font color="#6f6f6f">The Information</font>

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Search Results for "Intel Counters TSMC With"

Updated every 3 minutes via FreeNewsApi, GNews, Currents API & Google News

29 stories displayed
TSMC Is Reportedly Developing Advanced Chip Packaging Tech to Challenge Intel's Dominance
Yahoo Financetech

TSMC Is Reportedly Developing Advanced Chip Packaging Tech to Challenge Intel's Dominance

<a href="https://news.google.com/rss/articles/CBMiowFBVV95cUxPUF9iWWQ5aWtkeFN6MFBVVWtfYjBVU2VURDFkMGIybGRkNkM2cGt4cUtFY0FETVg0d20xWHdWNVl0VjJwMTdVcEZUTEktcHE1SkhRT0tJMHlndE1VY1BkY3kxUE13UXB2a3p6SEJXMjdwOWltUk1yNkVSYkNwMm5TemVQZ3BnQkNiMUlhRkcxMHh2RWdZaG9Tak9vM1FoZ1FtVE5Z?oc=5" target="_blank">TSMC Is Reportedly Developing Advanced Chip Packaging Tech to Challenge Intel's Dominance</a>  <font color="#6f6f6f">Yahoo Finance</font>

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Intel Stays in Musk’s Terafab Race Despite TSMC Discussions｜Daily News Digest｜2026-10-08｜web only
天下雜誌tech

Intel Stays in Musk’s Terafab Race Despite TSMC Discussions｜Daily News Digest｜2026-10-08｜web only

<a href="https://news.google.com/rss/articles/CBMiZ0FVX3lxTE8xamhvTHZDeXZ1NkxiRVdWZmg0Vnh4eE1XbE5OMXVUcUpEZWpsSlNIQUZqUDQ1YlAzV2pDYmVfWW0zejJoRmpEZzhnNVRISWEtYkZjMkZOLWNmanRwWTlhQ01SWFZYQjA?oc=5" target="_blank">Intel Stays in Musk’s Terafab Race Despite TSMC Discussions｜Daily News Digest｜2026-10-08｜web only</a>  <font color="#6f6f6f">天下雜誌</font>

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Intel Counters TSMC With Silicon Capacitors in Google AI Chip Packaging Deal, Taps MediaTek Support
finance.biggo.comtech

Intel Counters TSMC With Silicon Capacitors in Google AI Chip Packaging Deal, Taps MediaTek Support

<a href="https://news.google.com/rss/articles/CBMiYEFVX3lxTE1ZMkFJNFBsUVFsX05BbDZmdGtOOHRyb1F3YjZJV1d2cl9fSXktU2UwUEFWb3A0N01LaW05UzA0TmE5NnZnc19qa09ycWUwYlVZLTR4ZGE5Z0ZaZHB5Q1ZibA?oc=5" target="_blank">Intel Counters TSMC With Silicon Capacitors in Google AI Chip Packaging Deal, Taps MediaTek Support</a>  <font color="#6f6f6f">finance.biggo.com</font>

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TSMC reportedly develops EMIB-like packaging to counter Intel
digitimesworld

TSMC reportedly develops EMIB-like packaging to counter Intel

<a href="https://news.google.com/rss/articles/CBMilgFBVV95cUxOQkZjeVBjSm1ldXdlbVh0cW1FT0FybHZrOXI1NV9UYXV3OUhtaEpveGItcWZSenczTjFxRThuY3hDSVo3WG54WENFaFYxbUkwWkw2dXNvSjVzc1lvdTRKay1GWVRpdkZZbzFRQjlzZ0NzQzU4VjdTV1BPXzc2SFRJa0FtSE1XOEhGZHg2RW04X2M5Um80VUE?oc=5" target="_blank">TSMC reportedly develops EMIB-like packaging to counter Intel</a>  <font color="#6f6f6f">digitimes</font>

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Intel Plots A 14A Gen2 Node With Dual-Side Power Delivery To Counter TSMC And Samsung’s 1.4nm Push
Wccftechworld

Intel Plots A 14A Gen2 Node With Dual-Side Power Delivery To Counter TSMC And Samsung’s 1.4nm Push

<a href="https://news.google.com/rss/articles/CBMiowFBVV95cUxPcnJER29xNTdxRVR1Qng3aDF3bkpTUk9HQVVFQUhvT1Y3bDBkbmtnTmpBazBrbEtveWNSZXl6MWtrVldjZXJZYVkteDdWdkxaNm1saEFtWDlybElsVF9rREdIS1NhV2JQSzRYWHpzLVVCRDNPWDNlclhaT2RpOUhyOGdjNFdZT3VBWkVZY1ZNLXZIQml4OVNTRUNZc2JENTg2S0lF0gGoAUFVX3lxTFBlSngxQXlWUU9aUVhsOGd4dDVmS2JZa2djNHgwbFhUWmFqVnlXc05RRDJlTURCX3dzQldmeUZoQ2xkMkg5OUNtNG1abDhCNmQ4SXBXV0I0NGpVQzQ2Nm9GdS1oTFVWY1R1YWZuLWtyN1VIUUE2bU9QSDFxcGVhUE4tWC0wYmVEQlNrbGV2eTF5WW42bmFzSlpVWHc1aHM0eTV1UHFMMlB0dw?oc=5" target="_blank">Intel Plots A 14A Gen2 Node With Dual-Side Power Delivery To Counter TSMC And Samsung’s 1.4nm Push</a>  <font color="#6f6f6f">Wccftech</font>

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Intel vs TSMC: How CoWoS Packaging Constraints Could Create an Opportunity for Intel Foundry
I/O Fundtech

Intel vs TSMC: How CoWoS Packaging Constraints Could Create an Opportunity for Intel Foundry

<a href="https://news.google.com/rss/articles/CBMigAFBVV95cUxNYjVOTG9McExHaDgyTFE2bTFkYThNS2poeHZkY3BoaXN2TU9uanotY291djF2UjNtd3ZJdUtyMzBLSkNGdFpfVWNEUzVKeFRqbG1UYkNGakpmNVdKYnotWG9hMGRjY1JweGtBVHhkRlNmNXUtT3g4SHM2YkFBRkpKVQ?oc=5" target="_blank">Intel vs TSMC: How CoWoS Packaging Constraints Could Create an Opportunity for Intel Foundry</a>  <font color="#6f6f6f">I/O Fund</font>

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AMD Ramps 2nm EPYC Venice CPUs on TSMC as Intel Teases 10A and Beyond
HotHardwaregeneral

AMD Ramps 2nm EPYC Venice CPUs on TSMC as Intel Teases 10A and Beyond

<a href="https://news.google.com/rss/articles/CBMihgFBVV95cUxONWxJR29LSk01cGVwSkMxN0dPMUlLM1VzQVNHTnBJSUY4TDhlR3pRYWFsQXl6X1h3Y1hTcGk2Z0ItbHc3UUdvaWxPTUdwSHdKTEJDVlNtMWF1N0dUbzRFbERIenZNOEM2MTNOX3BlelVmN3NfdTd1NGpBR3VSMUZrMXljNjVwZw?oc=5" target="_blank">AMD Ramps 2nm EPYC Venice CPUs on TSMC as Intel Teases 10A and Beyond</a>  <font color="#6f6f6f">HotHardware</font>

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TSMC Developing 'EMIB-Like' Packaging to Counter Intel, Shares Surge 7.6%
BigGo Financeworld

TSMC Developing 'EMIB-Like' Packaging to Counter Intel, Shares Surge 7.6%

<a href="https://news.google.com/rss/articles/CBMidkFVX3lxTE1TNUtMQjJUZWdKbVFWU0ZESTZ5cEx1dU9sUVkzWnotS3U2VFBMdmhKTnYxYVo2YzRVWkJtNERTMnF5S29zaE83ZU90Ql9GaG5VME1ndzZkSzYyMW8wRS1Oc3BlM1RjY0ExWEZ6TzkzNEtsdXBFQWc?oc=5" target="_blank">TSMC Developing 'EMIB-Like' Packaging to Counter Intel, Shares Surge 7.6%</a>  <font color="#6f6f6f">BigGo Finance</font>

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TSMC is developing an advanced AI semiconductor packaging technology, which it internally calls 'quasi-EMIB,' and it may be similar to Intel's Embedded Multi-die Interconnect Bridge technology.
GIGAZINEtech

TSMC is developing an advanced AI semiconductor packaging technology, which it internally calls 'quasi-EMIB,' and it may be similar to Intel's Embedded Multi-die Interconnect Bridge technology.

<a href="https://news.google.com/rss/articles/CBMiakFVX3lxTE9ITV82SWsyc291dlNwQm0xZ3ljZkpJVFlIS1EyS1pvR1Z3VHRjdVNUbW10WThoZ0pReWNjTG9ZV0tkMHh2ZmdidG95ODRrWTItZzV3LU1NN2Yzc09nNzBnLU5tQVllWkRYOVE?oc=5" target="_blank">TSMC is developing an advanced AI semiconductor packaging technology, which it internally calls 'quasi-EMIB,' and it may be similar to Intel's Embedded Multi-die Interconnect Bridge technology.</a>  <font color="#6f6f6f">GIGAZINE</font>

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AI Boom Drives Demand for Ultra-Large Packaging as ASICs Expected to Shift from CoWoS to EMIB, Says TrendForce
TrendForcetech

AI Boom Drives Demand for Ultra-Large Packaging as ASICs Expected to Shift from CoWoS to EMIB, Says TrendForce

<a href="https://news.google.com/rss/articles/CBMicEFVX3lxTE5LVmpua0hSeV8ySUxkUGNLeHp2SFFXUjk0UnphNVE4MFJuVVlHTkV2bHFNalJ0cmZtSUtDSXN2Q1NrX1F5OVpEekN3aWY4aDdHMkd3QnBHcEp6eHdnZjVWbU9WODF6X21SMkoyUWQ0Mmw?oc=5" target="_blank">AI Boom Drives Demand for Ultra-Large Packaging as ASICs Expected to Shift from CoWoS to EMIB, Says TrendForce</a>  <font color="#6f6f6f">TrendForce</font>

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Could Google's Next TPU Shift Back to TSMC? Inside the EMIB vs. CoWoS Battle｜Industry｜2026-06-15｜web only
天下雜誌tech

Could Google's Next TPU Shift Back to TSMC? Inside the EMIB vs. CoWoS Battle｜Industry｜2026-06-15｜web only

<a href="https://news.google.com/rss/articles/CBMiZ0FVX3lxTFBjQ2tEVzFFNWpsUWo3S0hxWW1mXy1WQUExcVV3eTFWYUZsWUdCU1VMOVVkd3ZEalJHYXdQbkZHVDI1ZmxYQTg1ZkZoRVhsSDJUZ0FDRk42Qmw4Z3RFVVlJQW9fOE9UbzA?oc=5" target="_blank">Could Google's Next TPU Shift Back to TSMC? Inside the EMIB vs. CoWoS Battle｜Industry｜2026-06-15｜web only</a>  <font color="#6f6f6f">天下雜誌</font>

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The Ever-Shifting Relationship Between TSMC and Intel: A History of Competition and Cooperation
semivisiongeneral

The Ever-Shifting Relationship Between TSMC and Intel: A History of Competition and Cooperation

<a href="https://news.google.com/rss/articles/CBMihgFBVV95cUxQSVFGRHNTZmlEeFh5alJhODVHVnRRTUU5ajNJc1EtRFVJNU9JX0cyZm9jT0hBV2ZlMkRUTTUxSWY0RkZMa3dOeFJubm9mUVMtZ01LQkowMzdjLXNQbTlzRElRZTZDeFNocGw2TnktN1EwdUV3ekR4N3dKSFhCM0pYaDRvTHY5Zw?oc=5" target="_blank">The Ever-Shifting Relationship Between TSMC and Intel: A History of Competition and Cooperation</a>  <font color="#6f6f6f">semivision</font>

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Guest Column | The reason why Intel pulled the plug on Poland
TVP Worldgeneral

Guest Column | The reason why Intel pulled the plug on Poland

<a href="https://news.google.com/rss/articles/CBMikwFBVV95cUxNakNLZ2YzalBlMGNab3N6bTFCTUtOWXBTOXJ5ay1mblhacHNzODN3QUVPQ1JienBRdVgtSUcteVl4cUx5ejlxWGd4QmlWZTBSdl9BS0FkdGUxVWtkcm02LTNTelU3bVFpc25RTnI5RWtKWVBYWENnUWtIS0Y0d2lqMkNxXzVkdng1ZU5sWHNQdG1hRDg?oc=5" target="_blank">Guest Column | The reason why Intel pulled the plug on Poland</a>  <font color="#6f6f6f">TVP World</font>

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Intel and Samsung might be considering a foundry alliance to counter TSMC
TechSpotworld

Intel and Samsung might be considering a foundry alliance to counter TSMC

<a href="https://news.google.com/rss/articles/CBMipgFBVV95cUxNUEIxWmYtS24wV1hwa1k2YkplUFpYNGtXcFBISVlrQkFmdmhFdWNYRFg4LXhYNDhkSWg2Y0hyZmhuM09RbUJGeDI5cndTOTJ2by1ZNVhWaHNZV01xOGR5SXNOQkV5ZzNESDQ2dkxqaFg2MGdhWUdCLWlBZGhDM0dOOWxuQlg3QkI1NUtmek5JWlFmZDZMUWVXZHpTVC1CcDBCMWtjX2VB?oc=5" target="_blank">Intel and Samsung might be considering a foundry alliance to counter TSMC</a>  <font color="#6f6f6f">TechSpot</font>

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Apple Silicon production testing begins at Intel with 2027 mass shipment target
AppleInsidertech

Apple Silicon production testing begins at Intel with 2027 mass shipment target

<a href="https://news.google.com/rss/articles/CBMivwFBVV95cUxQblp3YXVfRG1HZU0xYXRFa0JpZjFvRWNXY1pxQkJzRVl5a2FhWW91LWVRREo3UlI0bDN0NDRpQXQ0SDI5V2JObUlqampidGpxMkZNNXFZNjgyd0pWNl9UYXR3TmpabmJ5RnRSejRjcW85VG5PblB2TWxLWDZCSlhoZEh4R05ma1Z0MzJ5N2M3RzRzZ3dzRXA4aUNXV3NZR2ZGQWFlVmtMRnZtUXl6aFo3dnc4VWI4dHJyR0RtUVlQQQ?oc=5" target="_blank">Apple Silicon production testing begins at Intel with 2027 mass shipment target</a>  <font color="#6f6f6f">AppleInsider</font>

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Intel Stock: AI Efficiency Could Counter Semiconductor Demand (NASDAQ:INTC)
Seeking Alphatech

Intel Stock: AI Efficiency Could Counter Semiconductor Demand (NASDAQ:INTC)

<a href="https://news.google.com/rss/articles/CBMimwFBVV95cUxNcFA1RDk4TUNBS2llSHcxWEYySmNTWG5ybHZNTU5sTEFtY3VaWmg5VWlfWVU5THI3QjFUdTctQ1lmendIMTBPYmdSeHdjZzJHanMzQ0tOQ1dXdnFsYjVBcDdxWnh5c0NGWW1XNHZHZGdnTlRiN1d1YnFxd3dLTlFHaHJNODV6ajdYWEFRbWMxZm5DSUUxTmQwd3VFZw?oc=5" target="_blank">Intel Stock: AI Efficiency Could Counter Semiconductor Demand (NASDAQ:INTC)</a>  <font color="#6f6f6f">Seeking Alpha</font>

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TSMC Accelerates 1.4nm Mass Production to First Half of 2028, Intensifying Advanced Node Race Against Samsung and Intel
finance.biggo.comtech

TSMC Accelerates 1.4nm Mass Production to First Half of 2028, Intensifying Advanced Node Race Against Samsung and Intel

<a href="https://news.google.com/rss/articles/CBMidkFVX3lxTE9rWUE1MXA4VUViVDFtQUY2bzdHWEs0VS0zaHNUMGF1NFVYclJLNkpUWVQ2bkpiUF9pX0Nta3RHNG5kR3MzQVFkYzF6N19LOV9GQUVzQkJqXzlxRE0zN3FVb08xRkl0Zkh2TDhzSUxJTHB2LUlwS1E?oc=5" target="_blank">TSMC Accelerates 1.4nm Mass Production to First Half of 2028, Intensifying Advanced Node Race Against Samsung and Intel</a>  <font color="#6f6f6f">finance.biggo.com</font>

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TSMC is not interested in buying Intel's fabs
Tom's Hardwaregeneral

TSMC is not interested in buying Intel's fabs

<a href="https://news.google.com/rss/articles/CBMikAFBVV95cUxPUUdpSWxaS19nc2wyNzdpTzZfN2E0MXB3X0xsOG9Hcll2Ylp6RUZUWkRLNGtjbWw4RUhSZDdMMXR2cmZPY3gybUxzdndFS3J4NXNlRndqRERRQU1qdkhEX0RJSVdhdkF5clN0V0tSckJyVEVxRDBNWjZhLUlCWnpsMG1QRVdYeGtLVFNhTlNUWnQ?oc=5" target="_blank">TSMC is not interested in buying Intel's fabs</a>  <font color="#6f6f6f">Tom's Hardware</font>

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Intel's 18A Yield Surges to 85%, Reportedly Secures Major Orders from Nvidia and OpenAI; Wall Street's AI Gold Rush Rakes in $1.6 Trillion in a Single Quarter
finance.biggo.comtech

Intel's 18A Yield Surges to 85%, Reportedly Secures Major Orders from Nvidia and OpenAI; Wall Street's AI Gold Rush Rakes in $1.6 Trillion in a Single Quarter

<a href="https://news.google.com/rss/articles/CBMidkFVX3lxTE9LY0hiVVdQcDROcWoyR3VkUk9WcDlGT2JWZi13YVRxM1pMWTdYc3dUWEc0b0NEb3RtZ1Y5YjlTSGx4aVlZMW1Jbmt6dF9EMjlTdThvOGFlbHR0dnA0LVU3Y2dnSmtCN3ZjOTRRT3ZQb2tNSWNBY0E?oc=5" target="_blank">Intel's 18A Yield Surges to 85%, Reportedly Secures Major Orders from Nvidia and OpenAI; Wall Street's AI Gold Rush Rakes in $1.6 Trillion in a Single Quarter</a>  <font color="#6f6f6f">finance.biggo.com</font>

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TSMC Takes Legal Action Against Former Executive For Allegedly Sharing AI Chip Tech With Intel: Report
Stocktwitstech

TSMC Takes Legal Action Against Former Executive For Allegedly Sharing AI Chip Tech With Intel: Report

<a href="https://news.google.com/rss/articles/CBMi-AFBVV95cUxQNEtxTThTUDh0b29HY0ptZlpYaU1xeWU5RVRleDlpU1MySDBPZHBZVVhGWjRUek1leS0xN0NJazlWd2o1SXU2ODR3OHhVbGhUSEM2cDdyc051WkFEYzZvcHF1LWNRUDl5eVhrMWdScjVDbFhIY1F6S0x6b0ZRYUYwLXRIalBIXzN6UkUtSXFFa1MtclJYOUxpUWpSVDVBdW5jdWZYVW9kaVhySEtsV1JibGQ0X2RsR05SVFlPVjBBUGhEb21Gb0Z6NjRwWHFpYl9hMnJ4UjNZTnVQUmtpR3lyUWFTb0tpWjBvZ2VzNFNPcGF4OFVzN3Q0Wg?oc=5" target="_blank">TSMC Takes Legal Action Against Former Executive For Allegedly Sharing AI Chip Tech With Intel: Report</a>  <font color="#6f6f6f">Stocktwits</font>

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MediaTek Considers Major US Chip Production Deal With TSMC To Counter Tariffs
HotHardwaretech

MediaTek Considers Major US Chip Production Deal With TSMC To Counter Tariffs

<a href="https://news.google.com/rss/articles/CBMidEFVX3lxTE1IaGFlbFZkLW5SY2dJVW02Y1h1Z05ELU5idFRQSS1iZW16bVhmbmNNcS1vV3Q2Q2hCNW5IZGZmNFVqb19NdzNzbU83WE8xU3pqbko0WHFTU2h0ZzVIUFM5R0FDZmxiQjF3RXJkaFd3XzBXdXNz?oc=5" target="_blank">MediaTek Considers Major US Chip Production Deal With TSMC To Counter Tariffs</a>  <font color="#6f6f6f">HotHardware</font>

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Intel talks Xeon 6 at Hot Chips 2024
Jon Peddie Researchtech

Intel talks Xeon 6 at Hot Chips 2024

<a href="https://news.google.com/rss/articles/CBMid0FVX3lxTFBGdjJzT1VWRjVuRWhHN0hCNExSRUpiUlkxbFllQXp4LWxMNDBleWx6bjNySE5EYS1iSnVyZ3pYMFJXMXIyX29wZnZnRnZmN25GN3UtMVVMREtmeGc2bmI3eEdWcWJkLTA0cElCczl4eFNlSTFSVXlz?oc=5" target="_blank">Intel talks Xeon 6 at Hot Chips 2024</a>  <font color="#6f6f6f">Jon Peddie Research</font>

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TSMC Pours $100 Billion into US for 2nm Expansion; CFO Says 'Not Leaving Opportunities for Others'
finance.biggo.compolitics

TSMC Pours $100 Billion into US for 2nm Expansion; CFO Says 'Not Leaving Opportunities for Others'

<a href="https://news.google.com/rss/articles/CBMidkFVX3lxTE85RHlDek1XcU1HZTZFOGxYNEowbHZISl9Yam1iSDY0V3FBekhZbkNuTUNzSW1ZYmMzSWN5Z3RtUnVnOURHUXVIZjc5WERUT25DVDdWY3NOMHVXd0ZHZktMVHlUU3F2QkdYQlQ4SzRCaXRhUDhHaUE?oc=5" target="_blank">TSMC Pours $100 Billion into US for 2nm Expansion; CFO Says 'Not Leaving Opportunities for Others'</a>  <font color="#6f6f6f">finance.biggo.com</font>

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TrendForce: TSMC to Mass-Produce Select Intel Products, CPUs Starting 2021
TechPowerUpgeneral

TrendForce: TSMC to Mass-Produce Select Intel Products, CPUs Starting 2021

<a href="https://news.google.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?oc=5" target="_blank">TrendForce: TSMC to Mass-Produce Select Intel Products, CPUs Starting 2021</a>  <font color="#6f6f6f">TechPowerUp</font>

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Intel chip delay forces shift to using more outside factories, shares drop
Reuterstech

Intel chip delay forces shift to using more outside factories, shares drop

<a href="https://news.google.com/rss/articles/CBMiyAFBVV95cUxPMmxINkkxaEZlTW4xMF8ySmxFemtPTzJGbmcyOFhBcUhvdUdPYWM2YXBBWXdFX0Z4MkhLb2FsRnRhQUt4VzhxRzN2QnhEVkFLSGd6d0xkY1NiTE5WcEZuQ293bGh4X3d2OEFXRXhnMHpyZjJlekJoU013TS1IaDhKSDFnME1uMnVkZ0w0b1MyeS0zU0pzWWlRb3ZCTVY0ZHhPdDA1dzhUUnZaaUNkTkRGMUZldjExUDdmblhjV011RDg5Zl9KQkg4Zg?oc=5" target="_blank">Intel chip delay forces shift to using more outside factories, shares drop</a>  <font color="#6f6f6f">Reuters</font>

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Intel Slips, and a High-Profile Supercomputer Is Delayed (Published 2020)
The New York Timesgeneral

Intel Slips, and a High-Profile Supercomputer Is Delayed (Published 2020)

<a href="https://news.google.com/rss/articles/CBMigwFBVV95cUxQY2dKUEtSTF91ZnhqQ2ZlUXVtQlVGbUVCUDhIUTBJUW5FSTc4M214Nkc4Q19GeGg0MS1DcWJ4Z3M3RXRPck5wcTFnRFgzYjltdjE2cjg5bnNtTEVsSjdhQS14Rmp1VDBLUUZLa0laRTNveWdwYnVMYk9VVG13SUlsLU0wZw?oc=5" target="_blank">Intel Slips, and a High-Profile Supercomputer Is Delayed (Published 2020)</a>  <font color="#6f6f6f">The New York Times</font>

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TSMC 5 nm Customers Listed, Intel Rumored to be One of Them
TechPowerUpgeneral

TSMC 5 nm Customers Listed, Intel Rumored to be One of Them

<a href="https://news.google.com/rss/articles/CBMimAFBVV95cUxOS2ppY2xubm5uY3AxeTFTMU9VcDFINU5qcmM5OV9PVmdNRGx6bUpDM0lDVzNIbkhFOG41VVh1Z201ZUlkQm43SXJSV2ZjSEhVcVc4VHdWVE5HNVRVcWZ3VGUtUHo2OGRPSG1aRjZWSUZnWTRMUVFvT0tZaC0zN3p5UmZxZ3ROT1hudjJIWmZOdUtnQ1RMejhzd9IBngFBVV95cUxOdG1SWTdpdDYzclFENHBXemswekptbDF6RURLSXIycGR0WkluV0VsQ21NVS1YbmdNMG1pY0ZqQjV2Q2I3RmstaXFGa3RwQS1JY0ljeFBjSkg1M1YzZHdsVXdfVm0xTlpfNnBoZGlyVnFCSkdCb1JhN1JfOW9NMHE1ZDhOYWh0NldMQ1l0bHFtckpxaUI1VzJDWGRWVjhoUQ?oc=5" target="_blank">TSMC 5 nm Customers Listed, Intel Rumored to be One of Them</a>  <font color="#6f6f6f">TechPowerUp</font>

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Intel reinvents in semiconductor industry amid US$7 billion loss
Tech Wire Asiapolitics

Intel reinvents in semiconductor industry amid US$7 billion loss

<a href="https://news.google.com/rss/articles/CBMiogFBVV95cUxNRHl6RHRSbTBvbjlPZmxES2M3YWdza2g3aUlzQTNRVXRyMk45OXZPSVlnMWZKbzFUcFVYQ25QNGNTMjI5WElpc2pScXliYjN1cGw5T05tNDBncHQ1bnZqbVFEYThHTUluUVREb3ZKbmw5ekZYTkVaN0VvYnRUUHJEYnRGbXlYU2didHRxVFlIWkJTNzhjUndwaS1aR0tNTnFtX0E?oc=5" target="_blank">Intel reinvents in semiconductor industry amid US$7 billion loss</a>  <font color="#6f6f6f">Tech Wire Asia</font>

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Samsung Electronics Tense Over TSMC-Apple-Amkor ‘Arizona Alliance’
Businesskoreatech

Samsung Electronics Tense Over TSMC-Apple-Amkor ‘Arizona Alliance’

<a href="https://news.google.com/rss/articles/CBMidEFVX3lxTE5KZk9MUW1nNWRDbnMzTGoza3g3a05jcXR0SFpiTTg3YV9CclhPc3dyc2Z3NTBTeDhVajlaVTNPdkphQ0g0cnVlQTludnFnTWNxbG5vX2xWSmZGSGJvSUlWQTlLN2tZcEVubXFWaFU5b0p4clN5?oc=5" target="_blank">Samsung Electronics Tense Over TSMC-Apple-Amkor ‘Arizona Alliance’</a>  <font color="#6f6f6f">Businesskorea</font>

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