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Category:All HeadlinesWorld & GeopoliticsMarkets & EconomyTech & AIPoliticsSearch results for: "Advanced Packaging Leads" (30 stories)

Top Headline Story

Advanced packaging leads Malaysia's push up the chip value chain as AI reshapes demand, says Yole analyst
Lead Storydigitimestech
1d ago

Advanced packaging leads Malaysia's push up the chip value chain as AI reshapes demand, says Yole analyst

<a href="https://news.google.com/rss/articles/CBMimwFBVV95cUxORzdLNUJfUF9rVllrWkdtZy1CeTBNRkIyOXAwVXJ2eGZ0NUtfb3pRRE1NZHJlMV9WOWczaEk5R2hXOFBZWXBSOWlKN3RZV3R5STRWR0lfSFVSbEZNZU1HVGZoMmRxMmZPWS1namp0UkQwMmxQM01QbXFCX3p1ZDlSNEgtaVN3M1VoUERxNjJLbDB6TDc0dXhZa0tqUQ?oc=5" target="_blank">Advanced packaging leads Malaysia's push up the chip value chain as AI reshapes demand, says Yole analyst</a>  <font color="#6f6f6f">digitimes</font>

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Search Results for "Advanced Packaging Leads"

Updated every 3 minutes via FreeNewsApi, GNews, Currents API & Google News

29 stories displayed
Advanced Packaging Leads The Way To Intel Foundry Success
Forbesworld

Advanced Packaging Leads The Way To Intel Foundry Success

<a href="https://news.google.com/rss/articles/CBMiswFBVV95cUxOTXpFSmJnTExndlJmM0JxUUNNdGU1aWdVdC13M3Y1NjVvdkM2VHVqUXlMNU1MRG52UER0OUZuYmdDd0NPOTBPc0dXeEhaWTNqckJDSW8tVlBVbDBrbVdjeWhKaW1GdW02U2tjNlg5NFY0S2txaTZyd0ZlaVFjY19DV2c0V1ZCV2VLTzE3a2tXZjZQblMtdFVSRWNfeHN2bGRPcGt5V1Q4X0ZmUWV1NUdXd3JxYw?oc=5" target="_blank">Advanced Packaging Leads The Way To Intel Foundry Success</a>  <font color="#6f6f6f">Forbes</font>

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Intel taps industry veteran Seok-Hee Lee to lead foundry packaging push
Reutersworld

Intel taps industry veteran Seok-Hee Lee to lead foundry packaging push

<a href="https://news.google.com/rss/articles/CBMiswFBVV95cUxNdVE2YVJoUzhHWXpFc0NJdEMxSzJ1cjJrX01ORTAzM2l2dU1lY3U3UlZBNHNXUGxSWHA4MGlEU21yNnlPank0WXpicEQwaFVOTFp4MnlPS0kxb1k2SllYbklELUozNkFZdVk5VFFwR3BTVy12SkZUU01zbjJUaktLMlFxY1JKdm1DamNkUmxKVGpTUV9WODh5bGsxWC1NeWJ2eW5ELTN0WktzaFJIaWk5UlV6MA?oc=5" target="_blank">Intel taps industry veteran Seok-Hee Lee to lead foundry packaging push</a>  <font color="#6f6f6f">Reuters</font>

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Why Advanced Packaging Is the New Bottleneck for AI Chips in Asia?
Asia Business Outlooktech

Why Advanced Packaging Is the New Bottleneck for AI Chips in Asia?

<a href="https://news.google.com/rss/articles/CBMiywFBVV95cUxPbE5MWEhKMlNiU3hFQXhxV1BEVUtrMTR6QzdrQVRsdW84RjZ5Z0VuYWpLQjlEX2FKZ0hjX2ZWTFJOYXBDZDJBQkwxdHA5dGRrSmo0TTFTLUprODFxSnQ5Z2ZWbWRnaGctcmFsM3N2SnQ4RUY1cktzbnp6ZnRxRU90QlMxbmlkeUZlVUdWcjBqdkpxRklGVUk2MTcxVGEwTUMtTTltT0pFRENvMDRPNHBVMXVhdG5RTnQ1cm5na09NZ2NzOFBUa1doWm9hQQ?oc=5" target="_blank">Why Advanced Packaging Is the New Bottleneck for AI Chips in Asia?</a>  <font color="#6f6f6f">Asia Business Outlook</font>

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Advanced Chip Packaging Technologies Market to Reach $87.6 Billion by 2030, Driven by AI and High-Performance Computing Demand
Yahoo Financetech

Advanced Chip Packaging Technologies Market to Reach $87.6 Billion by 2030, Driven by AI and High-Performance Computing Demand

<a href="https://news.google.com/rss/articles/CBMipwFBVV95cUxNWEpmRWplZDlnY3Q0NjJ3NXEtbXhMS1BnRVNibVhwbGRGNFhyVFJvRzVxQThzVjJFOWtjQWFkQ20xaHFobk1Tak5oUFE3am5ZTkFlU0JpcG1pVzA2cTFRdEt6eGZ1LVBNVHdINjZ3T0xTRWt5c3l4eWVYVEMzLWQ0ODAtNGlLMnJKcmthbHplaGdwbWpnRWRqS193T1U0Tm1NU0pwUHJMcw?oc=5" target="_blank">Advanced Chip Packaging Technologies Market to Reach $87.6 Billion by 2030, Driven by AI and High-Performance Computing Demand</a>  <font color="#6f6f6f">Yahoo Finance</font>

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Intel’s New Strategy May Not Start With Leading-Edge Nodes, but With Advanced Packaging
semivisiongeneral

Intel’s New Strategy May Not Start With Leading-Edge Nodes, but With Advanced Packaging

<a href="https://news.google.com/rss/articles/CBMif0FVX3lxTFB2ajBhVDZFcFA1V3pRZFpIdjAwR2xUeHhxa1JGemlLWTFYd20yeXFta3ZJVGFXQ1ZmTlpLMk5ORVEyQk94ZHNCZEJUMFk1amlpNWpxQk5Bb1hKZVZIUmdFb2VjUWszQy1xNXV5QnFFd3ktNTA1TUZWUzdUbXFFOVk?oc=5" target="_blank">Intel’s New Strategy May Not Start With Leading-Edge Nodes, but With Advanced Packaging</a>  <font color="#6f6f6f">semivision</font>

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Applied Materials Q3 FY 2026: Advanced Packaging and DRAM Accelerate Growth
The Futurum Groupgeneral

Applied Materials Q3 FY 2026: Advanced Packaging and DRAM Accelerate Growth

<a href="https://news.google.com/rss/articles/CBMirgFBVV95cUxOQVNidGs1cjh4MUlTVnl6UmVMQlhHYkg4cjRzX1BqXzNJWW1CaTluMW9QV21KamFTQWJaeE9MX2YxY0paNHh4eXQ0N091UFpyOHlVQXE1RldZRE5YSUEydXVBVWpSUmZqR0s4bGl5RV83Y040eWszNWhqQkhfd1FwNFZMUDlzNEhoUGdpZ1NLdHdjV3lOT3hfTHJwZ2otNzBtS3hlTDN6Y1FrSzlVdXc?oc=5" target="_blank">Applied Materials Q3 FY 2026: Advanced Packaging and DRAM Accelerate Growth</a>  <font color="#6f6f6f">The Futurum Group</font>

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Intel vs TSMC: How CoWoS Packaging Constraints Could Create an Opportunity for Intel Foundry
I/O Fundtech

Intel vs TSMC: How CoWoS Packaging Constraints Could Create an Opportunity for Intel Foundry

<a href="https://news.google.com/rss/articles/CBMigAFBVV95cUxNYjVOTG9McExHaDgyTFE2bTFkYThNS2poeHZkY3BoaXN2TU9uanotY291djF2UjNtd3ZJdUtyMzBLSkNGdFpfVWNEUzVKeFRqbG1UYkNGakpmNVdKYnotWG9hMGRjY1JweGtBVHhkRlNmNXUtT3g4SHM2YkFBRkpKVQ?oc=5" target="_blank">Intel vs TSMC: How CoWoS Packaging Constraints Could Create an Opportunity for Intel Foundry</a>  <font color="#6f6f6f">I/O Fund</font>

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Advanced Packaging Process Control Software Market Size, Share & Forecast 2036
Fact.MRtech

Advanced Packaging Process Control Software Market Size, Share & Forecast 2036

<a href="https://news.google.com/rss/articles/CBMihwFBVV95cUxQY0xsTExmcjJfZlA2NkZoYUhSSW54WmR6WlNHTFExdC1DUXBRdEJuUURGeDR4NWZUTjZFS085WExZdmRTUzRPeTZRRGQycWN2SzJVYi1MeFZxakdKWXRBbzF4RDRXeWRlUC01aHBqQjZfckRob19QSWhBaGQzYzlLMnVjVHNpdEU?oc=5" target="_blank">Advanced Packaging Process Control Software Market Size, Share & Forecast 2036</a>  <font color="#6f6f6f">Fact.MR</font>

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Intel Announces Leadership Appointment at Intel Foundry to Accelerate Development and Manufacturing
Intelworld

Intel Announces Leadership Appointment at Intel Foundry to Accelerate Development and Manufacturing

<a href="https://news.google.com/rss/articles/CBMi_AFBVV95cUxPeWVlUjUybE9wTmNLVEUtUk1OcXBtRWdKY1NDaTU1c2VxSzFZVFdVTU1ocUMwejlyR1dKVXVGU1BWS3dIOXBnWG1EZmFqdnM4WFo4RnhZOFFBbS1wNzdHMXI0NjRQQU1NMUJaXzV2OEVHU20zQ1hDbkgyaVhBeEFfV21DeExjUzZnNFI0ZHhIQms0aTRTMGttd2hEVVcyWUJTWHdRbkFhWFNUclBQaTA0akh5MGFEbjN1UThCd3dnODAxQ3k4U3ZfcS01cjFLZTd2UmZSd2RhVUpIVkxJN0JCMTZJal9xMXlxSV8tSjJCaXgyd2o4djRMQWpCbVk?oc=5" target="_blank">Intel Announces Leadership Appointment at Intel Foundry to Accelerate Development and Manufacturing</a>  <font color="#6f6f6f">Intel</font>

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[News] ASE Again Raises 2026 CapEx to Record US$10.5B; Eyes 2x Leading-Edge Advanced Packaging Revenue by 2027
TrendForcetech

[News] ASE Again Raises 2026 CapEx to Record US$10.5B; Eyes 2x Leading-Edge Advanced Packaging Revenue by 2027

<a href="https://news.google.com/rss/articles/CBMi5AFBVV95cUxQYTlKY2VVRU5lNE40cG94RnVzZUJFSzZfeHp0QVhhaWhrLWlGNDVMRlNfRi1GcUJYeEFHdnhGY3c4Z2VNc2FWLUYwREJ5NmluNk1UdVJYb0FQUjM5Mld6MXBCbXVhNGlKSTM2VXpJVl9lYmZBRHJnODlwSVZTOEkzWVZiM1pDWGJNYktRbFpSeHhvRC1DX2ozSUVpWWNzRFdSYmxGYVUxTElmWHJELXVPQm5DOXJnSDJCZ2QxelAtWWgxODhEbzJWUEg1UjJCYkNSQ1BCQ3V2dlU2b0RiNHRpcnQ5Z0M?oc=5" target="_blank">[News] ASE Again Raises 2026 CapEx to Record US$10.5B; Eyes 2x Leading-Edge Advanced Packaging Revenue by 2027</a>  <font color="#6f6f6f">TrendForce</font>

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Intel hires former SK hynix chief Lee Seok-hee to lead advanced packaging
The Korea Heraldgeneral

Intel hires former SK hynix chief Lee Seok-hee to lead advanced packaging

<a href="https://news.google.com/rss/articles/CBMiV0FVX3lxTE9BVGZ6S3g0cFZiUkM3bVlUa05GeEhHVDFoTF9oUDJGSlgzbXlqa3Q2RGpxanRCbDU2WDNyUlFUN3dMb0RiZHNRRDl1UmtLZlpvd2NocnNxSQ?oc=5" target="_blank">Intel hires former SK hynix chief Lee Seok-hee to lead advanced packaging</a>  <font color="#6f6f6f">The Korea Herald</font>

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TSMC's Advanced Packaging Dominance Firmly Entrenched; TrendForce: CoWoS-L to Lead Through 2028
BigGo Financegeneral

TSMC's Advanced Packaging Dominance Firmly Entrenched; TrendForce: CoWoS-L to Lead Through 2028

<a href="https://news.google.com/rss/articles/CBMidkFVX3lxTFBub1doNGlST0ppWEFiUXBFcl9YUzF4M1o5eTdBcGhRRmFaZUUxbFlSNmRpZ2tkMzRwU0VRNFNiX2FjZFJBbVR4azc5R2NEaE5zSkJrMlM0X283U3k5eU4wNFJmY2xYeVd5emRUOGxOZ0w4Z0pWOFE?oc=5" target="_blank">TSMC's Advanced Packaging Dominance Firmly Entrenched; TrendForce: CoWoS-L to Lead Through 2028</a>  <font color="#6f6f6f">BigGo Finance</font>

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Singapore to step up investments to extend lead in advanced manufacturing, such as in semiconductors
Singapore Economic Development Board (EDB)general

Singapore to step up investments to extend lead in advanced manufacturing, such as in semiconductors

<a href="https://news.google.com/rss/articles/CBMi2wFBVV95cUxQSjJjaEI2dmlUVVpGckd0QS1iLWw4MDJabERzclhIRXF1RU9OLXg3aEx1UmQ3NnRUS1pmQXExdS0tYzFybVZJSUhZb0NQSHU1bDhxaUNpSEdveEFyOVBwd0hWTWllbjA5NlRweW5UamE1NDRLWkMtVVdlaVo4VWRjU2hzMGxGcUxfM0lWdFgzbDJVRHotOUxCdklELUpYMGdLLW54aEN0bTJMRWlpRXhyX3lILW5GY2pyUzBtSkFJRlpHWFB2QVdtdFdrMHdTQVk0Z0xYMm9jWFpXWkk?oc=5" target="_blank">Singapore to step up investments to extend lead in advanced manufacturing, such as in semiconductors</a>  <font color="#6f6f6f">Singapore Economic Development Board (EDB)</font>

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Indra leading GIGaNTE project to develop autonomous Spanish gallium nitride and advanced packaging technologies
Semiconductor Todaytech

Indra leading GIGaNTE project to develop autonomous Spanish gallium nitride and advanced packaging technologies

<a href="https://news.google.com/rss/articles/CBMiigFBVV95cUxON21wR2oyWkVuWm5rZ3BZdi1NVHNUbXY4NG5Vd2RrempoRGc4YW1ZZHROTll4cE93M3JBaS0wRDBFNTdfTmFUTWpHYWZwQWFNQnZLY3Nmc3ZqTFZlT2pOaHZGc1ctMUpldGFmeWNhR2I2d1NQS1J6NzNyWE81cmNSV2NDcjNEd3ZkQ2c?oc=5" target="_blank">Indra leading GIGaNTE project to develop autonomous Spanish gallium nitride and advanced packaging technologies</a>  <font color="#6f6f6f">Semiconductor Today</font>

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Intel Hires Former SK Hynix CEO Seok-Hee Lee To Lead Advanced Packaging Push As Apple Partnership Fuels F
Benzingatech

Intel Hires Former SK Hynix CEO Seok-Hee Lee To Lead Advanced Packaging Push As Apple Partnership Fuels F

<a href="https://news.google.com/rss/articles/CBMiyAFBVV95cUxNSV9CNFJQWjJuU0kzVUxXOXZURENUTkNEZFdoYmdMdHZQb29yaHJiRlc0bzd3alQzR3J0bGRfNmV0UkhBNnREbXc5Q1JjNU5nS3BvWFhuOGczSTZqRGtwZkQ5cXJOaGhiMWR5Rzk3bnpiWWNiMm50b1RsbUNYalIxaUtidDVjbnhqeDl1VVdGYTlwXzk1d24tU3RNQkVFOXkwdi1mQlQ4UG45UklydURMMEFLWkRSU3hQeEJBb3BSMkhjb1lHMWxBSQ?oc=5" target="_blank">Intel Hires Former SK Hynix CEO Seok-Hee Lee To Lead Advanced Packaging Push As Apple Partnership Fuels F</a>  <font color="#6f6f6f">Benzinga</font>

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Leading Interconnect Semiconductor starts Shenzhen advanced packaging substrate plant
digitimesgeneral

Leading Interconnect Semiconductor starts Shenzhen advanced packaging substrate plant

<a href="https://news.google.com/rss/articles/CBMinwFBVV95cUxORkFVRjNPZ1pDb3E5VnRkUmNnM2g4ZS01cS1DUnJEUXRhdzNpUkdpVjFlZUt0LXBoQVR6WmoxWEt2d00xY0lTak5Qcnp3WWx0dFhfVU5vTElSRDlZbmI2RU1rVnRrNkE3a05SYlVsMmh1TnhtcWhsYzhreDVqeEQ3Mm43QkYtZjJFMnF1WEtsSDZkb3dqNE9wZHplT1lNaWc?oc=5" target="_blank">Leading Interconnect Semiconductor starts Shenzhen advanced packaging substrate plant</a>  <font color="#6f6f6f">digitimes</font>

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Intel Names New Advanced Packaging Chief
Semiecosystemgeneral

Intel Names New Advanced Packaging Chief

<a href="https://news.google.com/rss/articles/CBMieEFVX3lxTFBpNDcwZjgzNDg5cHNIM3h1YmtZQVh5Y1hhOW45bFFlcTZWbkZCRXlFbWtxNXhkdUZUUVRTUGMydmJNY2ZjcUxxTWRrd0lfdWxSY0dVdFFIdWlTTWtfWTdYWjN0MWdFT0w0VHFIWExKX0gwLW9nU0s1Zw?oc=5" target="_blank">Intel Names New Advanced Packaging Chief</a>  <font color="#6f6f6f">Semiecosystem</font>

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[News] Intel Taps SK hynix Ex-CEO as Foundry EVP to Lead Advanced Packaging Push as EMIB, HBI Scale Up
TrendForceworld

[News] Intel Taps SK hynix Ex-CEO as Foundry EVP to Lead Advanced Packaging Push as EMIB, HBI Scale Up

<a href="https://news.google.com/rss/articles/CBMi2wFBVV95cUxQOWlVcG1WZFlLczRTOHg4YVktZE1tUHliQmlFdkZidkk2SkUwcEJyaFlndzdGRjZBN0wzODZuTm13VlBYaklGS0xmVVFGUDF5T3ItMDFRVVFrNFNqMTRyMmxaeURrcHlMYjVCclVvQ3p5MHY4Sy10ZEpnbGlvdHRuN005bWNMQzRZb3FQcVFKRVNlSG9ya3I1eFVabURjVUxRTGgwZG4yVF9SSXc2Y0E2Y0VjU2hmakVXLXRHTnJPZEIyWTU5ZUp2SXlxSDBNSmJsakI2LXdTajd1WDA?oc=5" target="_blank">[News] Intel Taps SK hynix Ex-CEO as Foundry EVP to Lead Advanced Packaging Push as EMIB, HBI Scale Up</a>  <font color="#6f6f6f">TrendForce</font>

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Intel Recruits Former SK hynix CEO Lee Seok-hee to Lead Advanced Foundry Packaging
THE ELEC, Korea Electronics Industry Mediaworld

Intel Recruits Former SK hynix CEO Lee Seok-hee to Lead Advanced Foundry Packaging

<a href="https://news.google.com/rss/articles/CBMiZ0FVX3lxTE5FcUZWVlNNd0FkZEtxeFozblV6ZGpjYTNnTFdnRFJJSDU5NDF6b1VQNXpoQkx3bmJxanl0ZmUtdTJEVGU1OVEtWHlzOTl6Qy1HVU5OZVdPY3hqcnVtMG5Lb2gyNDk0dDQ?oc=5" target="_blank">Intel Recruits Former SK hynix CEO Lee Seok-hee to Lead Advanced Foundry Packaging</a>  <font color="#6f6f6f">THE ELEC, Korea Electronics Industry Media</font>

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Intel taps Seok-Hee Lee as EVP to lead advanced packaging and manufacturing
eciks.orggeneral

Intel taps Seok-Hee Lee as EVP to lead advanced packaging and manufacturing

<a href="https://news.google.com/rss/articles/CBMibkFVX3lxTE1qem1YOW5CMnBaM2ZGRnlEdExsMmVvY0lrQzFZY0lBbWFVdDNVTmszd1Z0WHpvMnhvUFpoRnN1aGJFY0FldTI4X0NrNEM1bGdVcUNWRWJzQW8xSHhaR3g5ei1iRDJqQ18taDBzTFdB?oc=5" target="_blank">Intel taps Seok-Hee Lee as EVP to lead advanced packaging and manufacturing</a>  <font color="#6f6f6f">eciks.org</font>

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ASML leads chip equipment charge into advanced packaging
digitimestech

ASML leads chip equipment charge into advanced packaging

<a href="https://news.google.com/rss/articles/CBMijwFBVV95cUxQczBSbU1OYU1kLXlyUVRQaHlyM2pCd09hMnJiMmJTOUZiRnNHOHJRNzBFc01FeGFSNUdwaVNvS3F1WkFQMDF5dFpvbzcwcXZmYU9kYkFOY19IVnNrTGRBdjFZeWZWS3pHQklRMnNTLWZUWjQ2Sl9pNWozQ2xIZFM4NmlMdmlqVUd0SzNhbmtxaw?oc=5" target="_blank">ASML leads chip equipment charge into advanced packaging</a>  <font color="#6f6f6f">digitimes</font>

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Intel hires former SK hynix chief Seok-Hee Lee to lead Intel Foundry advanced packaging — company establishing section as 'focused business with dedicated leadership'
Tom's Hardwareworld

Intel hires former SK hynix chief Seok-Hee Lee to lead Intel Foundry advanced packaging — company establishing section as 'focused business with dedicated leadership'

<a href="https://news.google.com/rss/articles/CBMiygFBVV95cUxPa0pFelY0QXhST3hWWXBkN2VzSXh5RWt6V1dHU3RBOEhscDFzNWJkZGoyOFJ3eVB5d1liYVFKVjJzamw4d0hfcHUxU3dWYjNSTzJuN05GT01pQnVRVnlNel9lX2tHYlBGNDFDemJZWTRpRll5YlhOUEZUSkxjZlNIOXR2VjRVa3c0aXZSc08tYkhYbEI2bDd4dFc3WUhnYkdvRUM1N2pnVG9HNlI2V1hsZXVGNGIzUUJkQUVWX1BoM3g0c2xaU0prWjNB?oc=5" target="_blank">Intel hires former SK hynix chief Seok-Hee Lee to lead Intel Foundry advanced packaging — company establishing section as 'focused business with dedicated leadership'</a>  <font color="#6f6f6f">Tom's Hardware</font>

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Intel Names Former SK Hynix CEO to Lead Advanced Packaging in Major Foundry Push
finance.biggo.comworld

Intel Names Former SK Hynix CEO to Lead Advanced Packaging in Major Foundry Push

<a href="https://news.google.com/rss/articles/CBMidkFVX3lxTE9GWV9GdVROWFVDNUd2eVJ3UUoxczR6OUk4OWlLb0ZGN1pVanE4aG1SVWFtT2Iya3dJdURLdEpVREdZd21IWERRcnYxTi1OUmo3NTdnLWJfTGJMWnVsYXFOQ1NGYWtjU1JCMHN3MDIxLVQ2eVBpVWc?oc=5" target="_blank">Intel Names Former SK Hynix CEO to Lead Advanced Packaging in Major Foundry Push</a>  <font color="#6f6f6f">finance.biggo.com</font>

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SK Hynix to build $13 bn new advanced chip packaging plant to bolster HBM lead
KED Globaltech

SK Hynix to build $13 bn new advanced chip packaging plant to bolster HBM lead

<a href="https://news.google.com/rss/articles/CBMid0FVX3lxTE5Lck13WVRJZmtnUjBpR2ZaWXplTVdMY2lMQllZY1UwWDJoZk5SeUZNaS1HX3doNGJ2b1FjQVB1RDY1bnM1c0lSNGRQa1N4cWRaX1otRmRsVFZtMDZVOXMzaDIxcFRBdkM5Rl9kSFRDZ1JVQXRINzVN?oc=5" target="_blank">SK Hynix to build $13 bn new advanced chip packaging plant to bolster HBM lead</a>  <font color="#6f6f6f">KED Global</font>

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Leading semiconductor firms are collectively ramping up investments—why has advanced packaging become the most formidable barrier to entry?
富途牛牛general

Leading semiconductor firms are collectively ramping up investments—why has advanced packaging become the most formidable barrier to entry?

<a href="https://news.google.com/rss/articles/CBMitwFBVV95cUxPeVNtUG52dF84YUVNMG9FRUlLckNpUzRVWGJ5UXNxczFQb2JnZWxtVEdZZG05MTR2aU9RbkFYdWZBNDlxUjdPU0xsQk55TEthTUNtVUxhVkxON0kxQVVKV0lYYl9xc25zZXJHX3BFWldhTmhVaFViS2J6ZW43cmdPUTE4T2JfSmxiVHBaN2JobUtCS0dONk5zTWYwemxFQkJEMTkwU3daRFl0SC01RXZwWTJ5ZjA1ZGs?oc=5" target="_blank">Leading semiconductor firms are collectively ramping up investments—why has advanced packaging become the most formidable barrier to entry?</a>  <font color="#6f6f6f">富途牛牛</font>

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Applied Materials Q1 FY 2026: AI Demand Lifts Outlook
The Futurum Grouptech

Applied Materials Q1 FY 2026: AI Demand Lifts Outlook

<a href="https://news.google.com/rss/articles/CBMikAFBVV95cUxPYVpBcnVuREo3T29CUHRzb0ttRTM2dHh2dGVaeVRKWDBmSXUxOVU1dEVwWC1VaTkxejdkb0ZQbXA1Q1ZNbGM3Vkt1VHpLd0E4ZmZQWi1nY2hEZ2gzTWM5Q0FFRlplTW52MHl4bkVFVFZiWFM0Q2xrRVJIWEFJc01RN0l4dWg4M2FGVWN3d1RGUXg?oc=5" target="_blank">Applied Materials Q1 FY 2026: AI Demand Lifts Outlook</a>  <font color="#6f6f6f">The Futurum Group</font>

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Intel Taps Semiconductor Veteran Seok-Hee Lee to Lead Advanced Packaging Push as Apple Deal Fuels Foundry Ambitions
Tekediatech

Intel Taps Semiconductor Veteran Seok-Hee Lee to Lead Advanced Packaging Push as Apple Deal Fuels Foundry Ambitions

<a href="https://news.google.com/rss/articles/CBMi1wFBVV95cUxQX3d4ZlNSZFpLcHp3T0hVTUhRYm5ORmwwYUR2X3FHX2NxSE1TcWM3aVNRTEc0cWNmWW0zY2sxZDQwcTBpdlhNQWlEQUFFTUE0SjVrWVA5T29ELWdETFFjc2taNnNTSXllWEJBQWZIcE1hYjZVdHN6MjlJUHd5eDF4UW80TG9USnVVU3R1eUpHTHdRT0hJVWRYZFVZRTNRdlRNcmJaZ2U4dFE4QjEyR0VSbUdwS19XZTJNSU9Wb18xcjZSNTJiN0FOUnI3cDJtWFRONEh4bnlHdw?oc=5" target="_blank">Intel Taps Semiconductor Veteran Seok-Hee Lee to Lead Advanced Packaging Push as Apple Deal Fuels Foundry Ambitions</a>  <font color="#6f6f6f">Tekedia</font>

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Innolux enters leading tier of advanced packaging with new RDL and TGV technology
digitimestech

Innolux enters leading tier of advanced packaging with new RDL and TGV technology

<a href="https://news.google.com/rss/articles/CBMilgFBVV95cUxNYzJRRHk4Yi1SZUk3NjhOaEx1Q01ma1RNRlpkcjl1X05sbHZrc1NxT1BGUUYyRU5idXluNkM1WVdqbGlFbDdDckJNaFdXUkZ3MUg1SGtUVF9qbEE4RUg4bFFyOG5MZHVHTEROMVNBMjVmdHV3RS1DNEZFRUxlLUtqSnBlcjBrSUpJLVFVQVpLNkZFVUMzd0E?oc=5" target="_blank">Innolux enters leading tier of advanced packaging with new RDL and TGV technology</a>  <font color="#6f6f6f">digitimes</font>

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[News] Chip Tool Giants Accelerate Advanced Packaging Push, Led by ASML, Tokyo Electron, and Others
TrendForcetech

[News] Chip Tool Giants Accelerate Advanced Packaging Push, Led by ASML, Tokyo Electron, and Others

<a href="https://news.google.com/rss/articles/CBMi1AFBVV95cUxOQk04Q1ZzWG9POWxFQlBZSjRGRzNSY0RIcFFZdGljQTd2bGVaYlNUclo4R195enRteWJ0NDJvelE3ZXhhRXJ1eTFWX2M5MXR4UzF5NW84bHVSeXJaTnR5MDhDOENnMlU1bkYtT3FXSzlidE9Cd1hoM29NeVlTZ05LY1Q5QnBMb0hyMG1tWGcwWkJxSm0xck9NaGozUzE5aXVza1lCLVJrZEhmSnBkSkwyWnAyQnVNNnc1UWtLLTNZNVRBVTF4b29nSEVKMXRKSUE4UktvaA?oc=5" target="_blank">[News] Chip Tool Giants Accelerate Advanced Packaging Push, Led by ASML, Tokyo Electron, and Others</a>  <font color="#6f6f6f">TrendForce</font>

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"Advanced Packaging Leads" — Live Google News Trends & Headlines